PoliJet 4990

Models	PoliJet System – 4880

RIP	PoliRIP V2.08 – 4880
Image Rendering	Halftone (screened 1-bit)
	Contone (colour 8-bit)
Screening	Standard PostScript Screening
	Adobe Accurate Screening
	Agfa Balanced Screening
	PerfectBLEND Screening
Linearisation	Yes
Press Dot Gain Compensation	Yes
Advanced Scan LIGHT	Yes
StripRITE Imposition	Optional
Adobe InRip Trapping	Optional
KoolToning Halftone Simulator	Optional
System Requirement	Processor – Pentium IV
	RAM – 256 MB (Preferable 1 GB+)
	Hard Drive – 1×40 GB (or more)
	Operating System – Windows XP Pro (or Windows 2000 Pro)
Imaging Device	PoliJet Inkjet Platesetter – 4880
Imaging Technology	Advanced Micro Piezo^TM drop-on-demand
	Variable-sized Droplet Technology and 3.5 pl Ultra Micro Dot^TM
Interfaces (Standard)	USB 2.0 (Compatible with 1.1), 10/100Mb Base Ethernet
Operating Voltage	AC 100V – 120V verison, 220V – 240V version
Operating Current	1.0A for 100-120V, 0.5A for 220-240V
Operating Frequency	50 – 60 Hz
Power Consumption (operating)	59 W or less
Dimension (w x d x h)	34″ x 30 ” x 14″
	864 x 762 x 356 mm
Weight (approximately)	39.4 kg / 83.7 lb
Acoustic Noise Level	<50 dB(A)
Warranty	One year. For more information please refer to www.epson.com
Baking Oven(PoliJet Baking Oven)	CP – 850
Fuser Type	Conveyorised
Feed opening	850mm
Operating Voltage	AC 220-240 Volts
Operating Frequency	50 / 60 Hz
Power	1000Watts
Dimension (w x h x d) (mm) (Including the tray dimension – as applicable)	1160x145x650
Weight (approximately)	45 Kg / 100 lb
PoliJet	PoliJet Offset Plates
Base Material	Polyester
Coating	Proprietory Hydrophilic Coating
Imaging Fluid	Epson Ultrachrome^TM K3 Ink
Imaging Quality	150 lpi @ 2880 dpi with Epson Variable Dot Size Technology (max)
Operating Enviornment (Temperature and Humidity)	50° to 75° F (10° to 24° C) less than 30% Relative Humidity
Imaging Speed (550x650mm @ 1440 dpi and 125 lpi) (approx.)	One set of 4 colour seperation per hour (bi-di imaging) – 4880
Baking Temperature	Surface temperature of 110^oC
Baking Time	2 mins
Max. Plate Width	432 mm
Plate Thickness	0.15, 0.20, 0.28mm

Models	PoliJet System – 7900

RIP	PoliRIP V2.08 – 7900
Image Rendering	Halftone (screened 1-bit)
	Contone (colour 8-bit)
Screening	Standard PostScript Screening
	Adobe Accurate Screening
	Agfa Balanced Screening
	PerfectBLEND Screening
Linearisation	Yes
Press Dot Gain Compensation	Yes
Advanced Scan LIGHT	Optional
StripRITE Imposition	Yes
Adobe InRip Trapping	Optional
KoolToning Halftone Simulator	Optional
System Requirement	Processor – Pentium IV
	RAM – 256 MB (Preferable 1 GB+)
	Hard Drive – 1×40 GB (or more)
	Operating System – Windows XP Pro (or Windows 2000 Pro)
Imaging Device	PoliJet Inkjet Platesetter – 7900
Imaging Technology	Advanced Micro Piezo^TM TFP (Thin Film Piezo) drop-on-demand technology
	Variable-sized Droplet Technology and 3.5 pl Ultra Micro Dot^TM
Interfaces (Standard)	USB 2.0 (Compatible with 1.1), 10/100Mb Base Ethernet
Operating Voltage	AC 100V – 120V verison, 220V – 240V version
Operating Current	1.0A for 100-120V, 0.5A for 220-240V
Operating Frequency	50 – 60 Hz
Power Consumption (operating)	70 W or less
Dimension (w x d x h)	53″ x 26″ x 48″
	1356 x 667x 1218 mm
Weight (approximately)	84.5 kg / 186 lb
Acoustic Noise Level	<50 dB(A)
Warranty	One year. For more information please refer to www.epson.com
Baking Oven(PoliJet Baking Oven)	CP – 850
Fuser Type	Conveyorised
Feed opening	850mm
Operating Voltage	AC 220-240 Volts
Operating Frequency	50 / 60 Hz
Power	1000Watts
Dimension (w x d x h) (mm)(including the tray dimension – as applicable)	1160x145x650
Weight (approximately)	45 Kg / 100 lb
PoliJet	PoliJet Offset Plates
Base Material	Polyester
Coating	Proprietory Hydrophilic Coating
Imaging Fluid	Epson Ultrachrome^TM HDR Ink
Imaging Quality	150 lpi @ 2880 dpi with Epson Variable Dot Size Technology (max)
Ink Density	< 50% Photo Black Ink
Operating Enviornment (Temperature and Humidity)	50° to 75° F (10° to 24° C) less than 30% Relative Humidity
Imaging Speed (550x650mm @ 1440 dpi and 125 lpi) (approx.)	Two sets of 4 colour seperation per hour (bi-di imaging) – 7900/9900
Baking Temperature	Surface temperature of 110^oC
Baking Time	2 mins
Max. Plate Width	610 mm
Plate Thickness	0.15, 0.20, 0.28mm

Models	PoliJet System – 9900

RIP	PoliRIP V2.08 – 9900
Image Rendering	Halftone (screened 1-bit)
	Contone (colour 8-bit)
Screening	Standard PostScript Screening
	Adobe Accurate Screening
	Agfa Balanced Screening
	PerfectBLEND Screening
Linearisation	Yes
Press Dot Gain Compensation	Yes
Advanced Scan LIGHT	Optional
StripRITE Imposition	Yes
Adobe InRip Trapping	Optional
KoolToning Halftone Simulator	Optional
System Requirement	Processor – Pentium IV
	RAM – 256 MB (Preferable 1 GB+)
	Hard Drive – 1×40 GB (or more)
	Operating System – Windows XP Pro (or Windows 2000 Pro)
Imaging Device	PoliJet Inkjet Platesetter – 9900
Imaging Technology	Advanced Micro Piezo^TM TFP (Thin Film Piezo) drop-on-demand technology
	Variable-sized Droplet Technology and 3.5 pl Ultra Micro Dot^TM
Interfaces (Standard)	USB 2.0 (Compatible with 1.1), 10/100Mb Base EthernetONT>
Operating Voltage	AC 100V – 120V verison, 220V – 240V version
Operating Current	1.0A for 100-120V, 0.5A for 220-240V
Operating Frequency	50 – 60 Hz
Power Consumption (operating)	80 W or less
Dimension (w x d x h)	73″ x 26″ x 48″
	1864 x 667 x 1218 mm
Weight (approximately)	116 kg / 256 lb
Acoustic Noise Level	<50 dB(A)
Warranty	One year. For more information please refer to www.epson.com
Baking Oven(PoliJet Baking Oven)	CP – 850
Fuser Type	Conveyorised
Feed opening	850mm
Operating Voltage	AC 220-240 Volts
Operating Frequency	50 / 60 Hz
Power	1000Watts
Dimension (w x d x h) (mm)(including the tray dimension – as applicable)	1160x145x650
Weight (approximately)	45 Kg / 100 lb
PoliJet	PoliJet Offset Plates
Base Material	Polyester
Coating	Proprietory Hydrophilic Coating
Imaging Fluid	Epson Ultrachrome^TM HDR Ink
Imaging Quality	150 lpi @ 2880 dpi with Epson Variable Dot Size Technology (max)
Operating Enviornment (Temperature and Humidity)	50° to 75° F (10° to 24° C) less than 30% Relative Humidity
Imaging Speed (550x650mm @ 1440 dpi and 125 lpi) (approx.)	Two sets of 4 colour seperation per hour (bi-di imaging) – 7900/9900
Baking Temperature	Surface temperature of 110^oC
Baking Time	2 mins
Max. Plate Width	820 mm
Plate Thickness	0.15, 0.20, 0.28mm

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